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Integrated circuit: Quiz

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Question 1: The Motorola 6800 series of computer-related chips, leading to the ________ and 88000 series (used in some Apple computers).
PowerPCMotorola 68000Motorola 6809Motorola 68000 family

Question 2: The term Large Scale Integration was first used by ________ scientist Rolf Landauer when describing the theoretical concept, from there came the terms for SSI, MSI, VLSI, and ULSI.
IBMGeneral ElectricHewlett-PackardIntel Corporation

Question 3: The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using ________.
Vacuum tubeDiodeElectronic componentSemiconductor device

Question 4: Among the most advanced integrated circuits are the microprocessors or "cores", which control everything from computers to ________ to digital microwave ovens.
Smartphone4GMobile phoneUniversal Mobile Telecommunications System

Question 5: The semiconductors of the periodic table of the chemical elements were identified as the most likely materials for a solid state vacuum tube by researchers like William Shockley at ________ starting in the 1930s.
American Telephone & TelegraphBell LabsWestern ElectricBell System

Question 6: The integrated circuit can be credited as being invented by both Jack Kilby of Texas Instruments[2] and Robert Noyce of ________ [3] working independently of each other.
Fairchild SemiconductorSilicon ValleyIntel CorporationShockley Semiconductor Laboratory

Question 7: Commercial circuit packaging quickly moved to the ________ (DIP), first in ceramic and later in plastic.
Dual in-line packageCPU socketPlastic leaded chip carrierSurface-mount technology

Question 8: What does the following picture show?

  Synthetic detail of an integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish), and substrate (green).
  The die from an Intel 8742, an 8-bit microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip.
  A CMOS 4000 IC in a DIP
  Upper interconnect layers on an Intel 80486DX2 microprocessor die.

Question 9: ________ is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal (typically aluminium) tracks deposited on them.
PhotolithographyNoble gasXenonEtching (microfabrication)

Question 10: Digital memory chips and ASICs are examples of other families of integrated circuits that are important to the modern ________.
Information societyInternet EconomyKnowledge marketInformation economy







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