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Desoldering: Quiz


Question 1: QFP chips have thin leads closely packed together protruding from the four sides of the ________ (IC); usually a square IC.
Central processing unitElectrical engineeringMOSFETIntegrated circuit

Question 2: The system takes advantage of the properties of ________ by melting it with hot air.

Question 3: In ________, desoldering is the removal of solder and components from a circuit for troubleshooting, for repair purposes, and to salvage components.
Electronic engineeringElectronicsElectrical engineeringEngineering

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