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Breadboard: Quiz

  

Question 1: Six years later, US Patent 3,496,419[3], granted in 1970 after a 1967 filing, refers to a particular ________ layout as a Printed Circuit Breadboard.
Printed circuit boardGerber FileSurface-mount technologySchematic capture

Question 2: ________ designs are a more extreme version of the same process: since producing prototype silicon is expensive, extensive software simulations are performed before fabricating the first prototypes.
Central processing unitIntegrated circuitElectrical engineeringMOSFET

Question 3: This is also in contrast to stripboard (veroboard) and similar prototyping ________, which are used to build more permanent soldered prototypes or one-offs, and cannot easily be reused.
Schematic capturePrinted circuit boardGerber FileSurface-mount technology

Question 4: Alternative methods to create prototypes are point-to-point construction, reminiscent of the original breadboards, ________, wiring pencil, and boards like stripboard.
CopperWire wrapSilverBeryllium

Question 5: Typically the spring clips are rated for 1 Ampere at 5 Volts and 0.333 Amperes at 15 Volts (5 ________).
HertzJouleWattBecquerel

Question 6: Complicated systems, such as modern computers comprising millions of transistors, diodes and resistors, do not lend themselves to prototyping using breadboards, as sprawling designs on breadboards can be difficult to lay out and ________.
DebuggingComputer softwareComputer programProgramming language

Question 7: A variety of electronic systems may be prototyped by using breadboards, from small analog and digital circuits to complete ________ (CPUs).
Central processing unitReduced instruction set computer64-bitMicroprocessor

Question 8: A breadboard (protoboard) is a construction base for a one-of-a-kind electronic circuit, a ________.
Planck constantMetrePrototypeKilogram

Question 9: Interconnecting wires and the leads of discrete components (such as ________, resistors, inductors, etc.) can be inserted into the remaining free holes to complete the circuit.
CapacitanceElectronic componentElectrical impedanceCapacitor

Question 10: ________ (ICs) in dual in-line packages (DIPs) can be inserted to straddle the centerline of the block.
Central processing unitMOSFETElectrical engineeringIntegrated circuit
















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